Acid Copper Plating

Deposition Control

Plating rectifier current density determines the rate of metal buildup across the panel surface and inside drilled through holes. Operators maintain cathodic efficiency by balancing brightener consumption against breakdown products through periodic chemical analysis of the bath. Thickness uniformity across the board depends on auxiliary cathodes and thief bars that absorb excess current near panel edges.

X-ray fluorescence spectrometry measures resulting copper thickness on test coupons to verify compliance with performance specifications.

Reliability Parameters

Thermal stress testing evaluates deposit integrity by exposing plated boards to molten solder float conditions without inducing barrel cracking or foil delamination. Tensile strength and elongation percentage values characterize the mechanical behavior of the electroplated metal under thermal expansion loads imposed during assembly soldering operations. Structural defects such as nodular growths or internal voids compromise electrical continuity within plated through holes during subsequent thermal cycles.

Tensile elongation exceeding ten percent ensures the electrodeposited copper withstands z-axis expansion forces generated during wave soldering and surface mount reflow.