High shear rate squeeze flow during multi-stage lamination induces non-Newtonian thinning in ultra-thin prepregs, requiring precise pressure step timing to prevent microvia voiding and trace displacement.
High-frequency laminate rheology dictates prepreg flow kinetics, fixing pressed dielectric thickness, local impedance stability, and panel registration yield.
Viscoelastic boundary slip and capillary pressure dictate microvia filling and trace stability during high-density circuit board lamination.
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