Chemorheological modeling predicts thermoset gelation and squeeze flow, defining heating rates and platen pressures to hold sub-20 µm dielectric variations within ±1 µm.
Predictive squeeze flow modeling couples chemorheology and layout copper density to prevent microvia voiding, trace swimming, and dielectric thickness drift.
Dynamic prepreg viscosity and cure kinetics dictate resin flow windows, microvia filling completeness, and layer encapsulation during HDI board lamination.
Optimizing inner layer registration requires balancing thermal expansion tolerances through four-slot pinning while managing prepreg viscosity windows under staged pressure.
Dynamic parallel plate rheometry under controlled 2 °C/min thermal ramps defines the minimum viscosity window for thin prepreg lamination success
Viscoelastic boundary slip and capillary pressure dictate microvia filling and trace stability during high-density circuit board lamination.
Sub-30 µm dielectric void suppression requires matching non-Newtonian dynamic viscosity to vacuum press ramps to maintain shear flow prior to cross-linking gelation.
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