Triaxial Strain Rosette Placement and Signal Acquisition Basics
Triaxial rosettes placed adjacent to component corners capture multi-axis dynamic strain and strain-rate spikes, preventing latent solder interconnect fracture.
Quantifying Strain Gradients in Dense Circuit Board Assemblies
Quantifying dynamic strain gradients and rate-dependent tensile limits around dense BGA corners prevents latent dielectric pad cratering during assembly.