Establishing Quantitative Strain Rate Envelopes for High Density Lead Free Circuit Assemblies
Establishing quantitative strain rate envelopes prevents intermetallic cleavage and pad cratering in lead-free circuit assemblies during manufacturing.
Quantifying Strain Gradients in Dense Circuit Board Assemblies
Quantifying dynamic strain gradients and rate-dependent tensile limits around dense BGA corners prevents latent dielectric pad cratering during assembly.