Calculating Microvia Partial Inductance in High Speed Printed Circuit Board Escapes
PEEC formulation extracts microvia partial self-inductance from barrel aspect ratio and capture pad geometry, confirmed by de-embedded coupon S-parameters.
Optimizing IEEE 1149.1 Boundary Scan Register Architectures in High Density System Layouts
Partitioning boundary scan registers into parallel sub-chains cuts test vector execution time while maintaining high fault coverage on dense boards.
Resolving Intermittent High Speed Signal Integrity Escapes Surviving Static Advanced Boundary Scan Verification
Resolving intermittent high speed signal integrity escapes requires pairing static boundary scan with embedded IJTAG at speed stress testing to catch dynamic physical layer failures.
Quantifying Return Path Inductance across High Density Microvia Transition Pin Fields
Return path inductance across microvia fields drops when ground vias sit within two pitch distances of signal transitions, stabilizing loop impedance up to 50 GHz.
Optimizing Hybrid Probing Access and Boundary Scan Execution Matrices for Complex Non-Scan Logic Clusters
Combining IEEE 1149.1 boundary scan with targeted flying probe access closes logic cluster fault gaps while protecting net integrity and lowering unit test time.