Powder Specification
A highly refined mixture of solder alloy and flux containing extremely fine metal spheres enables the precise printing of ultra-dense microelectronic interconnects. This class of material, known as Type 6 solder paste, is characterized by powder particle sizes ranging between five and fifteen micrometres. The uniform size of these spheres permits the paste to flow smoothly through the smallest apertures of modern stencils.
Printing Performance
Apertures designed for fine-pitch components require these smaller particles to prevent clogging and to achieve high transfer efficiency during the printing phase. Using Type 6 solder paste ensures that there are enough metal spheres across each tiny opening to form a consistent solder brick. If larger particle sizes are used, the risk of erratic deposition and stencil clogging increases dramatically.
The increased surface area of the fine powder makes the paste more sensitive to oxidation, demanding tighter control over the reflow atmosphere, which often requires a nitrogen purge. This inert atmosphere prevents the formation of solder balls during the heating cycle.
Assembly Application
Applying this fine-grade paste is standard practice in advanced semiconductor packaging and micro-BGA assembly. The precise deposits generated during the printing step minimize short circuits and open joints on dense boards. This choice of material enables high manufacturing yields on complex, compact consumer electronics.
