Glass Reinforcement
Lightweight glass fabrics with flattened bundles offer improved resin distribution for thin-core multilayer builds. Selecting 1067 prepreg provides a middle ground between the ultrathin 106 and the more robust 1080 styles. It utilizes a spread-weave pattern that eliminates the large windows found in standard weaves.
This material is primarily used to build dielectric layers ranging from 2.0 to 3.0 mils.
Impedance Control
Variation in trace performance is reduced when the underlying substrate presents a more uniform medium for electromagnetic waves. The 1067 prepreg minimizes the dielectric constant delta between the glass and resin regions. Signal integrity improves because the differential pair signals travel over a consistent surface.
Engineers specify this glass style for designs operating in the 10 to 25 GHz range.
Dimensional Stability
Handling during the layup process requires precision to avoid distorting the thin glass carrier. A 1067 prepreg provides enough mechanical strength to resist warping while still allowing for the high resin content necessary for hole filling. Excessive handling can induce stresses that appear as registration errors after the etching stage.
Proper storage in humidity-controlled environments prevents moisture absorption before lamination. Reliability in multilayer registration depends on the predictable shrinkage of the glass fabric.
