Mechanically Spread Glass

Fiber Wetout

Automated optical inspection systems mounted downstream of the spreading heads detect optical density variations that indicate incomplete resin penetration across the web width. Ultrasonic C-scan testing measures acoustic impedance anomalies in cured laminate panels to locate micro voids caused by poor fiber wetout during the mechanical pressing phase. Proper filament separation ensures that the matrix material surrounds every individual strand uniformly before the composite material enters the multilayer press.

Lamination Shear

High pressure consolidation forces eliminate trapped air pockets between adjacent plies of spread glass prepreg during multilayer printed circuit board fabrication. Mechanical spreading reduces yarn thickness variability which improves thickness control across finished rigid circuit boards. Dielectric breakdown voltage testing verifies that internal insulation layers maintain adequate electrical strength after thermal pressing cycles.