Huray Model

Parameter Extraction

Acquiring the necessary parameters for this model requires analyzing the physical surface profile of the copper foil before lamination. The method relies on three main variables, which include the average nodule radius, the number of nodules per unit area, and a flat area correction factor that accounts for the smooth copper base. Modern optical profilometer scans can extract these values directly from the unbonded foil, allowing engineers to input them into electromagnetic field solvers to predict the behavior of stripline or microstrip transmission lines.

Applying these accurate surface parameters prevents the significant underestimation of loss that occurs when using traditional two-dimensional roughness models, especially on high-speed low-loss laminates.

Conductor Optimization

Utilizing this sphere-based model allows fabricators to select the optimal combination of copper foil treatment and laminate material for a specific design target. By balancing the size of the copper spheres against the thickness of the dielectric layer, designers can minimize signal attenuation while maintaining acceptable peel strength. This analytical step reduces the need for expensive iteration cycles and prototype builds during board development.