
Modelling Non Uniform out of Plane Dielectric Constant Frequency Dispersion in PAM4 Substrates
Integrating z-axis dielectric dispersion with resin distribution data prevents impedance mismatches and vertical eye closure in 112G PAM4 channels.

Integrating z-axis dielectric dispersion with resin distribution data prevents impedance mismatches and vertical eye closure in 112G PAM4 channels.

Split post cavity resonance measures in-plane substrate permittivity; z-axis core corrections prevent multi-ohm stripline impedance errors on woven glass panels.

Anisotropic dielectric tensor modeling eliminates up to 8 ohm trace impedance errors and timing skew in high speed package substrates compared to isotropic models.

Accurate millimeter-wave substrate modeling demands 3D tensorial permittivity and causal frequency dispersion to prevent impedance and differential skew errors.

Out-of-plane permittivity in glass-reinforced multilayer stackups runs lower than datasheet figures, requiring Z-axis test methods to hold impedance.

Directional dielectric permittivity variance in multilayer laminates requires evaluating in-plane and out-of-plane Dk tensors to prevent impedance errors.
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