Silica Filler ~ Area ~ Sourcing

A three dimensional render shows a double sided ESD brush mechanism cleaning the edge of a printed circuit board on a fixture.

High Density Interconnect Glass Transition Temperature Copper Plating Elongation

Substrate Z-Axis Thermal Expansion Mechanics in High-Density Interconnect Laminates

Z-axis laminate expansion exceeding copper ductility during lead-free reflow drives microvia failure, requiring high-Tg filled dielectrics and coupon screening.

A blue plastic tray holding various ceramic capacitors rests inside the steel machinery housing of an automated placement system.

Resin Content Filled Resin Systems Shear Stress

Managing Rheological Resin Shear Stress on Heavy Inner Layer Copper Conductors during Vacuum Lamination Pressing

Staging hydraulic lamination pressure and damping heating rates above dynamic viscosity minimums prevents hydrodynamic resin shear from displacing heavy copper inner conductors.

Silica Filler

Substrate Z-Axis Thermal Expansion Mechanics in High-Density Interconnect Laminates

Managing Rheological Resin Shear Stress on Heavy Inner Layer Copper Conductors during Vacuum Lamination Pressing

What the firm knows, published