
Evaluating Solder Joint Fatigue Dynamics during High Volume ICT Actuation
Minimizing ICT solder joint fatigue requires triaxial strain gauge profiling below 500 microstrain at actuation speeds under 1,000 microstrain per second.

Minimizing ICT solder joint fatigue requires triaxial strain gauge profiling below 500 microstrain at actuation speeds under 1,000 microstrain per second.

Balancing micro-probe forces with precision push-fingers prevents substrate strain over 500 microstrain, protecting fine-pitch BGAs and MLCCs from fixture damage.
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