Predictive squeeze flow modeling couples chemorheology and layout copper density to prevent microvia voiding, trace swimming, and dielectric thickness drift.
Precise control of prepreg minimum viscosity and press temperature ramp rates prevents core squeeze out and micro voiding in thin laminate stackups.
Dynamic resin squeeze flow across ultra smooth copper foils demands precise thermal press ramping to prevent micro-voiding and hold tightly controlled plane spacing.
Modelling slip velocity and pressure gradients across smooth copper foils prevents resin starvation and locks dielectric thickness tolerances during lamination.
Matching prepreg melt viscosity minima to press pressure ramps prevents thin-core distortion and resin starvation in high-density multilayer lamination.
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