Substrate Thermal Distortion Mechanics in Surface Mount Lines
Substrate thermal distortion stems from CTE mismatch and copper asymmetry, requiring tight dynamic warpage limits and carrier tooling to protect joint yield.
Quantifying Dynamic Thermal Warpage Effects on Fine Pitch Component Solder Joint Voiding Dynamics
Dynamic thermal warpage alters fine pitch component standoff during reflow, trapping flux outgassing and increasing solder joint voiding percentages.
Predicting Thermomechanical Anisotropic Deformation across Non Uniform Sequential Lamination Subassemblies in High Layer Count Boards
Predict anisotropic deformation in sequential lamination by coupling layer-specific thermal expansion tensors with non-linear viscoelastic resin cure shrinkage.