Resolving Dynamic S-Parameter De-Embedding Drift Caused by Micro-Coaxial Probe Wear
Dynamic de-embedding drift from micro-coaxial probe wear is resolved through inline contact monitoring, automated tip cleaning, and dynamic error-box updates.
Measuring Micro-Fracture Signal Degradation across High Speed Coupling Capacitors
Micro-fractures in high-speed coupling capacitors elevate insertion loss and phase jitter; wideband S-parameter screening catches latent dielectric failures.
Extracting Return Path Discontinuity Metrics from Multi Port Vector Network Analyzer Measurements
Extracting return path discontinuity metrics requires multi-port VNA s-parameters, IEEE 370 de-embedding, and IFFT conversion to quantify impedance spikes.