Correlate CT density gradients to microsections by locking segmentation thresholds to the lowest radial slice fill percentage measured on baseline coupons.
Plated through hole solder joints evaluated under IPC standards require strict vertical fill, top and bottom fillet wetting, and bounded radiographic voiding.
Achieving vertical hole fill on heavy copper PCBs requires extended preheat profiles, thermal relief spokes, and precise solder paste volumetric overprinting.
IPC Class 3 compliance requires minimum 75 percent vertical barrel fill and under 15 percent internal voiding verified via precision microsectioning.
Optimizing barrel fill on high thermal mass boards requires thermal relief geometries, elevated topside preheat, and controlled alloy contact duration.
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