Staging hydraulic lamination pressure and damping heating rates above dynamic viscosity minimums prevents hydrodynamic resin shear from displacing heavy copper inner conductors.
Predictive squeeze flow modeling couples chemorheology and layout copper density to prevent microvia voiding, trace swimming, and dielectric thickness drift.
Modelling slip velocity and pressure gradients across smooth copper foils prevents resin starvation and locks dielectric thickness tolerances during lamination.
Viscoelastic boundary slip and capillary pressure dictate microvia filling and trace stability during high-density circuit board lamination.
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